Samsung Electronics and Broadcom signed a five-year, over $200 billion memorandum of understanding to bolster memory chips, advanced packaging, and sub-2-nanometer foundry manufacturing for AI accelerators, with memory types HBM4 and HBM4E produced at Samsung’s Pyeongtaek campus. The deal aims to diversify Broadcom’s supply chain beyond TSMC, giving it access to Samsung’s memory and packaging capabilities for custom AI ASICs for hyperscalers like Google and Meta. For Samsung, the agreement addresses its struggling foundry market share and yields on advanced nodes by securing a major, multi-year commitment from a large customer. The MoU also includes packaging advances that integrate memory and logic to boost AI performance, reflecting a broader push into AI infrastructure partnerships. Separately, Korean industry officials highlighted a broader $950 billion in semiconductor partnerships announced at the San Francisco AI Summit, including SK Group’s $750 billion in memory-chip supply deals and expanded AI data center collaborations. Taken together, the announcements underscore a coordinated push by Korea’s tech giants to strengthen AI chip supply chains and data-center capabilities while competing with dominant players in the global foundry market.