Changxin Memory Technologies.

CXMT begins HBM3E risk production while still two generations behind rivals

China’s CXMT has started risk production of HBM3E memory, signaling a milestone toward reducing Western tech dependency and narrowing the AI memory gap, though it remains two generations behind the top suppliers with HBM3E expected in mass production by 2027. The company is ramping capacity from about 200,000 wafers per month toward 350,000 by year-end and potentially 600,000 later, while current yields for HBM3 stacks run around 25%, with specs centering on a 1,024-bit interface, 9.2–12.4 Gbps per pin, and up to 1.2 TB/s bandwidth in 24–36 GB configurations.