Korean memory giants Samsung Electronics and SK Hynix have secured multi-year, forward-purchase contracts totaling about $950 billion to lock in high-bandwidth memory (HBM) supply for AI data centers through 2030, with Samsung’s portion around $200 billion and SK Hynix’s about $750 billion involving Nvidia and other U.S. firms. The deals are intended to stabilize memory supply for leading AI accelerators, as current HBM capacity is constrained and new capacity will take years to come online. The announcements were made at a San Francisco AI summit hosted by President Lee Jae Myung, highlighting broader efforts to deepen U.S.–Korea tech ties and diversify AI infrastructure investments. Analysts describe the agreements as strategic moves to secure memory capacity for hyperscalers and to facilitate joint development of next-generation HBM and related memory solutions, including co-investments in AI data centers. The arrangements reflect a shift toward fixed, long-term commitments in a tight AI hardware market, extending beyond GPUs to broader server components. Parallel industry chatter notes ongoing long-term purchase discussions for CPUs and other components among global players.